• CMOS technology from 65nm to 1.2um ( low and high voltage )
  • BiCOS high voltage technology upto 700V
  • SiGe high frequency technology 3.3v/1.8V and ft of 240 Ghz ( max)
  • Bipolar standard buried collector technology for obsolete devices
  • GaAs for MMICs
  • Multilayer PCB technologies both rigid and flexible
  • MCM technology
  • Multiple types of IC packages available for assembly ( Call for list)
  • Multi-die in a package
  • Flip - chip assembly available