IC design, rfic design, analog ic design, analog asic design, analog and rf/wireless asic, and module design technologies from Signal Processing Group Inc.

CMOS technology from 65nm to 1.2um ( low and high voltage )

BiCOS high voltage technology upto 700V

SiGe high frequency technology 3.3v/1.8V and ft of 240 Ghz ( max)

Bipolar standard buried collector technology for obsolete devices

GaAs for MMICs

GAN for RFMW

Multilayer PCB technologies both rigid and flexible

MCM technology

Multiple types of IC packages available for assembly ( Call for list)

Multi-die in a package

Flip - chip assembly available

Chip on Board assembly available